In our dynamic micro world we create micro-systems-technology-modules by means of the latest design and manufacturing technology. That enables Micro Hybrid to execute the hermetic sealing of assemblies or the vacuum packaging of sensor elements. We design and manufacture electronic flat assemblies with automatic and highly flexible SMD technology. In addition, we offer the complete back-end process of the semiconductor production to directly assimilate specific IC’s from the wafer. Integrated electronic data collection (Traceability) by means of BDE forms part of our quality standards as does the automatic optical inspection (AOI) and the continuous ESD protection from the receipt of materials right to the shipping of the final product. Since 1997, the Micro Hybrid Electronic GmbH operates according to the quality management system DIN EN ISO 9001.
PCB Assembling
The PCB continues to be the basis of most electronic components. As an electronic service provider we buy, assemble and test PCBs. The combination of classic base materials and ceramic substrates is also forms a part of our standard program.
Hybrid Technologies
Component Assembly
We complete your printed circuit boards to function modules.
Final Tests
We test your product in detail before we deliver. To do so, we have various testing systems, including in-circuit-tester and automatic optical inspection, in place.
