Fields of Business  »
Microsystems

MEMS combines micro technologies to new function systems. Technologies as microelectronics, microoptics and micromechanics are processed to new function systems. Structures of MEMS are only some micrometers wide. Sensors, actors and electronics are parts of microsystems. Goal are systems working complex functions in a very small space. Micro-Hybrid Electronic GmbH as multi technology partner offers a big count of services for the development and production of microsystem components.

  • application of inexpensive bare dies possible
  • highest part density
  • full automatic production in best quality
  • combination with technologies of EMS possible
  • complete development and production in our company

Pick & Place

Pick and Place is a process to pick chip or electronic component and place it on a target.
Our 220mē cleanroom allows manually prototyping and full automatically series production of microsystem components.

Bonding

To bond is one of our standard procedures. The application of the suitable bonding technology i.e. for COB (chip on board) guarantees a high reliability, even at higher operating temperatures.

Packaging

Electronic packaging is hermetic enclosure of electronic components. The material, shape and conditioning (i.E. Windows) are adaptable to consumer specifications in most cases. In addition, the device can be filled with a backfill gas, such as Krypton or Nitrogen. Also we can evacuate the device (vacuum).

3D-Laserprocessing

3D-Laserprocessing is a technology of rapid prototyping for production of housings and components for samples and small series for micro systems.
Also 3D-laserprocessing is used for the production of tools i.e. for plastics injection.

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Services of MEMS / MEOMS technology