- Application of MEMS technologies and advanced technologies
- Technical circuit solutions, hard- and software concepts
- PCB
- Hybrid technology and ceramic carrier
- LTCC, sensoric/actuatory component on basis of LTCC
- SMD/THT assembly
- Circuit- and system layout
- High temperature-AVT up to 250°C and higher
- DIE-processing, Chip- and wire bond processes
- SIP-solutions
- Passivation: painting, scuba diving, potting, glob-top
- Hermetic sealing: soldering, gluing, welding
- Optical tests, electrical tests, function tests
- Laser technology:
- Active/Passive-calibration
- mechanical processing
- closing of metal housings
- electrical contacting
- Combination of different technologies (SMD, Hybrid, DIE, THT) for determination of optimal AVT-solutions in accordance with the requirement concept
- Introduction/combination of new technologies und packaging methods, customer- and product specific
- Implementation of passivation according to requirements
- Technologies for the hermetical sealing on basis of metal and ceramics, also in conjunction with other materials (e.g. optical elements) and defined interior atmosphere (protective gas, inert gas) as well as vacuum
