Within our application consulting we closely cooperate with you to find the perfect combination of technological options to realize the ideal sensor. In this way even such projects emerge that cannot be realized on the basis of conventional production standards. Even harsh environments won ́t stop us.
Whether at the idea finding, concept or product development phase – you can access the project at any stage of the development process. We synergistically combine our technological competences in electronic and mechanical design, software engineering, optics, microelectronic packaging as well as simulation and test to perform the optimal customized solution. For you to reach your goals, we are also able to adapt and further develop our existing technologies and processes as part of our process development. Joint and cooperative projects with reknown universities and institutes regularly provide us with new impulses to extend our portfolio. A powerful team consisting of physics, technologists, design engineers, hard- and software developers is awaiting your challenge!
- Ceramic board technologies:development of new material systems and combinations for thick film, LTCC, AlN, tape on substrate, SiC, isolated metal support, thick film on metal;
- Assembling and soldering technologies
- Chip on board
- Hermetic sealing technologies
- Mechanical 3D design and construction
- Flow and thermal simulation
- Analog and digital electronic hardware design and simulation
- Microcontroller and PC based software design and simulation
- Measurement systems for optical characterization and calibration
- Durability and reliability verification
- Statistical evaluation of all measurement results
- Customized housing and packaging
- Micro system CAD
- Layout for PCB, thickfilm and LTCC circuits