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Thick film circuits

Inhouse production of thick film circuits

We manufacture small to medium quantities of thick film substrates and use state-of-the-art screen printing machines for the assembly of resistors, conductor strips, contact systems and multi-level wiring. Special precision of the resistance value is achieved by an active and passive laser adjustment. By means of screen printing, glazes and protective lacquers can also be applied to protect the circuits.

Sinter furnace REHM with magazine dryer
screen printing line with magazine dryer
Laser trimming
thick film substrate with platium structure, layer thickness of 3µ
thick film substrate with platium structure, layer thickness of 3µ

Standard hybrid double sided mixed metal

 

This graph shows the typical set up of a ceramic thick flim circuit
This graph shows the typical set up of a ceramic thick flim circuit

Technical details

Substrate: Al2O3
Standard size: 4" × 4"
Standard substrate thickness: 0,25 – 1 mm
Layer thickness: typically: ca. 5 ... 50 μm
Paste systems: AgPd, AgPt, Au, resistor pastes, dielectrics, overglaze
Construction: Monolayer, Multilayer (typically: 4 layers) duplex print, metallized through-holes, vias, interlayer connection
Resistors: Thick film pastes, trimmable, also PTC for sensor applications
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